贝格斯 Gap Filler 1100SF
特点和好处
导热系数:1.1 W/m
无硅放气或提取
超协调,专为脆性和低应力的应用
环境和加速治疗时间表
100%固体物,无固化副产物
间隙填充1100sf是硅敏感应用的热溶液。材料为两部分组成在室温或高温下固化。该材料具有低模量的性能,然后固化软,弹性弹性体,有助于减少热循环应力在操作过程中,几乎消除应力在低应力应用程序。
两部件彩色协助为混合指示剂(体积比1:1)。混合系统将在室温下固化。与固化的热垫材料,液体的方法提供了无限的厚度变化不大或无应力在装配位移。间隙填充1100sf,虽然表现出一定的天然粘性特征,不用于热界面的应用需要一个机械结构键。
应用:
间隙填充1100sf可以混合和分配使用双筒筒包与静态混合器和手动或气动枪或高容量的混合和分配设备(加热可以降低粘度)
Temperature Dependence of Viscosity
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The viscosity of the Gap Filler 1100SF material is temperature dependent. The table below provides the multiplication factor to obtain viscosity at various temperatures. To obtain the viscosity at a given temperature, look up the multiplication factor at that temperature and multiply the corresponding viscosity at 25°C.
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Temperature
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Multiplication Factor
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°C
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Part A
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Part B
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20
|
1.43
|
1.57
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25
|
1.00
|
1.00
|
35
|
0.58
|
0.50
|
45
|
0.39
|
0.30
|
50
|
0.32
|
0.24
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性能:
配置可用
Property
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Imperial Value
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Metric Value
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Test Method
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Color / Part A
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Yellow
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Yellow
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Visual
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Color / Part B
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Red
|
Red
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Visual
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Viscosity as Mixed (cps) (1)
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450,000
|
450,000
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ASTM D2196
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Density (g/cc)
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2.0
|
2.0
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ASTM D792
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Mix Ratio
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1:1
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1:1
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***
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Shelf Life @ 25oC (months)
|
6
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6
|
***
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Property As Cured
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Color
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Orange
|
Orange
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Visual
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Hardness (Shore 00) (2)
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60
|
60
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ASTM D2240
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Heat Capacity (J/g-K)
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0.9
|
0.9
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ASTM E1269
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Continuous Use Temp (°F) / (°C)
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-76 to 257
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-60 to 125
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***
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Electrical
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Dielectric Strength (V/mil)
|
400
|
400
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ASTM D149
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Dielectric Constant (1000 Hz)
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5.0
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5.0
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ASTM D150
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Volume Resistivity (Ohm-meter)
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1010
|
1010
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ASTM D257
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Flame Rating
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V-O
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V-O
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U.L. 94
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Thermal As Cured
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Thermal Conductivity (W/m-K)
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1.1
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1.1
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ASTM D5470
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CURE SCHEDULE
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Pot Life @ 25oC (min) (3)
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240 min (4 hr)
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240 min (4 hr)
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***
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Cure @ 25oC (hours) (4)
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24
|
24
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***
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Cure @ 100oC (min) (4)
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10
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10
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***
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1) Brookfield RV, Heli-Path, Spindle TF @ 2 rpm, 25°C
2) Thirty second delay value Shore 00 hardness scale
3) Time for viscosity to double
4) Cure schedule (rheometer - time to read 90% cure)
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