贝格斯 Gap Pad HC 3.0特点和优点
导热系数: 3.0W
热阻抗: 0.44℃-in2/W(@30psi)
垫片材料厚度: 0.508mm-3.175mm
阻燃等级: V-O
连续使用温度: ?60℃+200℃
绝缘击穿电压: ﹥5000V
高度整合、低压缩应力
玻璃纤维增强的抗剪、抗撕裂
Gappad HC 3.0是一种柔软的间隙填充材料 额定的热传导率为3 W/m·K材料提供出色的热性能在较低的压力,
由于一个独特3 W/m填料包和低模量树脂配方。增强材料非常适合高性能应用和要求低的装配应力。
典型的应用包括:电信.电子消费品.ASIC和DSP.散热片散热片
性能:
配置可用
Property
|
Imperial Value
|
Metric Value
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Test Method
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Color
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Blue
|
Blue
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Visual
|
Reinforcement Carrier
|
Fiberglass
|
Fiberglass
|
***
|
Thickness (inch) / (mm)
|
0.020 to 0.125
|
0.508 to 3.175
|
ASTM D374
|
Inherent Surface Tack
|
2
|
2
|
***
|
Density (Bulk Rubber) (g/cc)
|
3.1
|
3.1
|
ASTM D792
|
Heat Capacity (J/g-K)
|
1.0
|
1.0
|
ASTM E1269
|
Hardness (Bulk Rubber) (Shore 00) (4)
|
15
|
15
|
ASTM D2240
|
Young's Modulus (psi) / (kPa) (1)
|
16
|
110
|
ASTM D575
|
Continuous Use Temp (°F) / (°C)
|
-76 to 392
|
-60 to 200
|
***
|
Electrical
|
Dielectric Breakdown Voltage (Vac)
|
>5000
|
>5000
|
ASTM D149
|
Dielectric Constant (1 Mhz) (3)
|
6.5
|
6.5
|
ASTM D150
|
Volume Resistivity (Ohm-meter)
|
1010
|
1010
|
ASTM D257
|
Flame Rating
|
V-O
|
V-O
|
U.L. 94
|
Thermal
|
Thermal Conductivity (W/m-K) (3)
|
3.0
|
3.0
|
ASTM D5470
|
Thermal Performance vs. Strain
|
Deflection (% strain)
|
10
|
20
|
30
|
Thermal Impedance (°C-in2/W) 0.040" (2)
|
0.57
|
0.49
|
0.44
|
1) Young’s Modulus, calculated using 0.01 in/min. step rate of strain with a sample size of 0.79 inch2 after 5 minutes of compression at 10% strain on a 1mm thickness material.
2) The ASTM D5470 test fixture was used. The recorded value includes interfacial thermal resistance. These values are provided for reference only. Actual application performance is directly related to the surface roughness, flatness and pressure applied.
3) Minimum value at 20 mil.
4) Thirty second delay value on Shore 00 hardness scale.
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