贝格斯 Hi-Flow 565U
特点和好处
热阻抗:0.04°c-in2 / W(@ 25 psi)
很高的导热性:3.5 W / mK
52°C相变温度
不支持
嗨,流565u是导热相变材料的应用形式表垫。在应用程序中使用的材料发生相变的52°经过相变易,高流量565u打湿导致在一个非常低的热阻抗的热界面。
嗨,流565u取代容易在较低的压力,提供一个与最好的抗热性能润滑脂。嗨,流565u在厚度一致,确保可靠的性能。嗨,流565u附由硬橡胶辊或刮刀压力目标表面。
典型的应用包括:处理器盖散热片.处理器模盖或散热片.FBDIMM散热片
性能:
配置可用
表格的形式推出,吻切部分–无孔
嗨,流565u是有限的一个正方形或长方形的部分设计。尺寸公差是±0.20英寸(0.5mm)
Property
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Imperial Value
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Metric Value
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Test Method
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Color
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Gray
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Gray
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Visual
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Reinforcement Carrier
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None
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None
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***
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Thickness (inch) / (mm)
|
0.010
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0.254
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ASTM D374
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Continuous Use Temp (°F) / (°C)
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257
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125
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***
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Phase Change Temp (°F) / (°C)
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126
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52
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ASTM D3418
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Electrical
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Flame Rating
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V-O
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V-O
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U.L. 94
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Thermal
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Thermal Conductivity (W/m-K) (1)
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3.5
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3.5
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ASTM D5470
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Thermal Performance vs Pressure
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Pressure (psi)
|
10
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25
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50
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100
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200
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TO-220 Thermal Performance (oC/W)
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0.29
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0.27
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0.25
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0.24
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0.23
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Thermal Impedance (oC-in2/W) (2)
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0.05
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0.04
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0.04
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0.04
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0.03
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1) This is the measured thermal conductivity of the Hi-Flow coating. It represents one conducting layer in a three-layer laminate. The Hi-Flow coatings are phase change compounds. These layers will respond to heat and pressure induced stresses. The overall conductivity of the material in post-phase change, thin film products is highly dependent upon the heat and pressure applied. This characteristic is not accounted for in ASTM D5470. Please contact Henkel Product Management if additional specifications are required.
2) The ASTM D5470 test fixture was used and the test sample was conditioned at 70°C prior to test. The recorded value includes interfacial thermal resistance. These values are provided for reference only. Actual application performance is directly related to the surface roughness, flatness and pressure applied.
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