贝格斯 Bond-Ply LMS-HD
点和优点
导热系数:1.4W
垫片材料厚度:0.254mm/0.305mm
阻燃等级:V-O
连续使用温度:-60℃+180℃
特殊的介电强度
非常低的界面电阻
消除机械紧固件
Bond-Ply LMS-HD导热 热固性层压材料。产品 由高性能热 导电低模量有机硅化合物 涂层在固化的核心,双内衬 保护膜。
低模量硅酮 设计有效吸收机械应力 装配水平的CTE失配引起的冲击和振动, 同时提供卓越的 热性能(与PSA技术)和 长期诚信。
Bond-Ply LMS-HD将 通常被用于结构动力 秉承 组件和印刷电路板的散热片。
典型的应用包括:离散半导体封装粘结到散热器或散热片
性能:配置可用
轧辊形式
切件
表格形式
保质期:粘结层lms-hd是热固化材料,应存放在温度控制的条件。建议储存温度范围为5-25°C应该用来维持5个月保质期的最佳特性。
Property
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Imperial Value
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Metric Value
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Test Method
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Color
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Yellow
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Yellow
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Visual
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Reinforcement Carrier
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Fiberglass
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Fiberglass
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***
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Thickness (inch) / (mm)
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0.010, 0.012
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0.254, 0.305
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ASTM D374
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Continuous Use Temp (°C) / (°F)
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-76 to 356
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-60 to 180
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***
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Adhesion
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Lap Shear @ RT (psi) / (MPa) (1)
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200
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1.4
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ASTM D1002
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Electrical
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Value
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Test Method
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Breakdown Voltage, Sheet (Vac) (1)
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5000
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ASTM D149
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Breakdown Voltage, Laminated (Vac) (2)
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4000
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ASTM D149
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Dielectric Constant (1000 Hz)
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5.0
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ASTM D150
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Volume Resistivity (Ohm-meter)
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1011
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ASTM D257
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Flame Rating
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V-O
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U.L. 94
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Thermal
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Post-Cured Thermal Conductivity (W/m-K) (3)
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1.4
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ASTM D5470
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Thermal Performance vs Lamination Method
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Lamination Pressure (75 psi) (4)
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Constant
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IPO
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TO-220 Thermal Performance (°C/W)
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2.1
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2.3
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1) The ASTM D149 test method on cured LMS-HD material. No pressure was applied to the LMS-HD during the cure cycle.
2) A 1/2" diameter probe was laminated with LMS-HD to a 2" X 2" plate at 200 psi for 30 seconds, then cured with no pressure at 160°C for 6 minutes. The cured assembly was then tested per ASTM D149. This LMS-HD sample resembles a typical lamination application.
3) The ASTM D5470 (Henkel Modified) test procedure was used on post-cured LMS-HD material. The recorded value includes interfacial thermal resistance. These values are given for customer reference only.
4) TO-220 Thermal Performance testing, per The Henkel RD2010 specification for Laminates, was completed on laminated TO- 220 assemblies. Lamination was completed at 75 psi for 30 seconds for "IPO" (Initial Pressure Only) and at a constant 75 psi during the lamination and curing process for "Constant". No additional pressure was applied during TO-220 thermal performance testing.
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