贝格斯 Gap Filler 1400SL
特点和好处
导热系数: 1.8W
硬度:(Shore00) 40
阻燃等级: V-O
连续使用温度: -60℃+200℃
介电强度:(V/mil) 2500V
自动流平
非常柔软
振动阻尼
Gap Filler 1400SL液体空隙填充材料拥有热传导和硅基材料特点。这种材料拥有非常低的粘度,从而使得其会自动流平和自动填充空隙,导致热传导更佳。液体材料能够满足各种不同的间隙形状厚度,而且在位移时应力极小,可以解决个别应用中对界面材料厚度和形状的需求。Gap Filler 1400SL间隙填充导热材料应用于不需要牢固粘接结构的热传导界面。
典型的应用包括:汽车电子.电信.封装半导体和磁性元件与散热片.有机硅敏感应用.照明.电力供应
性能:
配置可用
Property
|
Imperial Value
|
Metric Value
|
Test Method
|
Color / Part A
|
Yellow
|
Yellow
|
Visual
|
Color / Part B
|
White
|
White
|
Visual
|
Viscosity, As Mixed (cps) (1)
|
5000
|
5000
|
ASTM D2196
|
Density (g/cc)
|
2.5
|
2.5
|
ASTM D792
|
Mix Ratio
|
1:1
|
1:1
|
***
|
Shelf Life @ 25oC (months)
|
6
|
6
|
***
|
Property As Cured
|
Color
|
Yellow
|
Yellow
|
Visual
|
Hardness (Shore 00) (3)
|
40
|
40
|
ASTM D2240
|
Heat Capacity (J/g-K)
|
0.9
|
0.9
|
ASTM D1269
|
Siloxane Content (ppm)
|
40
|
40
|
***
|
Continuous Use Temp (°F) / (°C)
|
-76 to 392
|
-60 to 200
|
***
|
Electrical As Cured
|
Dielectric Strength (V/mil)
|
250
|
250
|
ASTM D149
|
Dielectric Constant (1000 Hz)
|
6.0
|
6.0
|
ASTM D150
|
Volume Resistivity (Ohm-meter)
|
1011
|
1011
|
ASTM D257
|
Flame Rating
|
V-O
|
V-O
|
U.L. 94
|
Thermal As Cured
|
Thermal Conductivity (W/m-K)
|
1.4
|
1.4
|
ASTM D5470
|
CURE SCHEDULE
|
Working Time @ 25oC (min) (4)
|
120 min
|
120 min
|
***
|
Cure @ 25oC (hrs) (4)
|
24
|
24
|
***
|
Cure @ 100oC (min) (4)
|
30
|
30
|
***
|
1) Brookfield Rheometer, Part A and Part B mixed 1:1 ratio.
2) See application note for storage and handling recommendations.
3) Thirty second delay value, Shore 00 scale.
4) Parallel Plate Rheometer, see reactivity application note.
|